Description
IMPACT-IAAC 2016
International Microsystems, Packaging, Assembly and Circuits Technology conference
3 topic of conference:
- Plenary speeches by Invensas, Prismark, Advantech, Univ. of Tokyo, Leveno
- Industrial session by ASE Group, Nan Ya Plastic Corp., SPIL Siliconware, Tong Hsieng Electronic Industries, Ltd.
- Special forum by ICEP Japan, Internet of Vehicle, IEEE Sip Roadmap, Iot&Wearable, Fanout Forum, IEC Embedded
- Organiser by IEEE, Imaps Taiwan, Industrial Technology Research Institute, TPCA
- Sponsor by ATOTECH, Board Tek Electronics Corp., Dow, Eternal, JSR Corp., SENTEC, TSMC, Unimicron
For more information, please refer to IMPACT 2016 webpage.
Event Target
Cluster managers, Cluster Policy Makers
Event Type
Conference