Description
The 7th ESTC Conference, known as the premier European scientific conference event in the field of microelectronics packaging and system integration, will be held from 18th to 21st of September, 2018 in Dresden. The conference is organized by key members of Silicon Saxony.
This international event brings together both academics as well as the industry leaders to present and discuss state-of-the-art and the future trends in packaging and integration technologies. ESTC provides a perfect opportunity to learn about the latest developments in those fields. Save the date right now! This major event only takes place once every two years. ESTC is supported by IEEE-EPS in association with IMAPS-Europe. The 2018 conference continues the line of prestigious events since the birth of ESTC 2006 in Dresden, followed by Greenwich, Berlin, Amsterdam, Helsinki and Grenoble every even year.
More information at www.estc-conference.net
ESTC conference provides an unique opportunity to exhibit products or services to more than 400 engineers and managers from all areas of the microelectronics and system integration industry. These include materials & processes for semiconductor packaging, assembly and interconnect technologies, test & other equipment, simulation and other software tools, wafer bumping services, market research and research centers. To meet the audience interests best, the exhibition will be focused on and organized matching the application clusters: Automotive, Testing & Sensors and Manufacturing, Simulation.
