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ESSDERC & ESSCIRC in Dresden

Selected Profile: 
Date: 
03/09/2018 to 06/09/2018
Address: 
campus of TU Dresden Dresden
Germany
51° 3' 1.4724" N, 13° 44' 14.1432" E
DE
Description: 

The 48th European Solid-State Device Research Conference ESSDERC and the 44th European Solid-State Circuits Conference ESSCIRC sponsored by Cool Silicon take place in Dresden, Germany from September 3 - 6, 2018. ESSDERC and ESSCIRC provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. Cool Silicon supports this conference which is organized by several of its key cluster members.

The increasing level of integration for system-on-chip design made available by advances in semiconductor technology is, more than ever before, calling for a deeper interaction among technologists, device experts, IC designers and system designers. While keeping separate Technical Program Committees, ESSDERC and ESSCIRC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both communities.

Conference Highlights

 >​3 Plenary presentations  >3 ESSDERC keynote presentations  >3 ESSCIRC keynote presentations

 >Special Focus Sessions on        - FDSOI        - Power Electronics        >Presentation of IEEE and ESSDERC/ESSCIRC Awards  >ESSDERC/ESSCIRC Gala Dinner on Wednesday, September 5, 2018   >Tutorials        - The Future of Mobility: Reliability, Readiness & Robustness of Integrated Circuits            Chapter 1: EOS & ESD            Chapter 2: Reliability & Readiness of IC’s            Chapter 3: Mobility & Sensing        - IC Design for Automotive        - Ultra-Low Power Sensors for Condition Monitoring      >Workshops

>>MORE INFORMATION

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