Business mission to Silicon Saxony

Submitted by Nadja Dehne on 03 March 2023

Mission_SiliconSaxony169

Get to know the microelectronics & ICT region of Saxony, attend the Silicon Saxony Day, individual B2B meetings, and receive financial support of 415 € for your trip to Dresden facilitated by EXCITE.

On June 21, 2023 , the 17th Silicon Saxony Day will take place at the International Airport of Dresden. With over 400 participants, it is Saxony's premier ICT and networking conference. Join the event for cross-industry networking, knowledge & technology transfer and an open exchange on ICT technologies and their use.

Saxony - Europe's heart of microelectronics

  • Saxony has unique concentration of companies and research institutions in the sectors of microelectronics and nanoelectronics, nanotechnology, organic & flexible electronics, energy-efficient systems, next generation communication, and smart systems
  • about 80,000 employees active in microelectronics & ICT
  • areas: development & manufacturing of integrated circuits (ICs), supply of materials and equipment, production and distribution of electronic products, development of software etc.

Every third microchip produced in Europe is made in Saxony

  • big chip manufacturers such as Infineon, GlobalFoundries, Bosch and X-FAB located in Saxony but also research institutions and SMEs active in that field supplying infrastructure, equipment, components, (automation) software & services

Meet innovative Silicon Saxony members @Silicon Saxony Day!

Financial support & individual itinerary for SMEs, RTOs & cluster organisations with the help of EXCITE

Get to know the microelectronics region of Saxony, attend fruitful events, individual B2B meetings, and receive financial support of 415 € for your trip.* 

For more details, please contact: Alesia Ramanishyna [email protected]

* This lump sum can be applied for European SMEs (members of clusters), scale-up organisations such as RTOs and clusters participating in the trips to Germany for three days minimum. 

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